Samsung today announced a slew of new technical components for mobile devices. First, Samsung has developed new embedded memory modules for smartphones that adopt the e-MMC 4.41 specification. This specification’s biggest improvement is that it provides improved multitasking and the ability to help devices better manage read/write cycles. Samsung has already started manufacturing the 8GB moviNAND chips, and will follow with the 16GB chips later this month. Second, Samsung introduced a range of new CMOS sensors for mobile devices, including the S5K4E5 module for smartphones. This new CMOS sensor has adopted back side illuminated (BSI) pixel technology, which improves low-light performance by 30%.
Read the original post: Samsung Announces New Memory, Camera, Processor Chips
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